Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2008-01-29

2008-01-29

Chapman, John E. (Department: 2856)

Measuring and testing

Speed, velocity, or acceleration

Acceleration determination utilizing inertial element

C073S514380, C073S514330, C257S686000

Reexamination Certificate

active

07322239

ABSTRACT:
A semiconductor device includes a lead frame. The lead frame has a chip mounting section and a plurality of leads. The chip mounting section has a base section, an insulation film covering the base section, a plurality of inter-connect sections, and a chip mounting area. The leads surround the chip mounting section. The semiconductor device also includes a first semiconductor chip having a plurality of first electrode pads. The semiconductor device also includes first bonding wires for connecting the first electrode pads to the inter-connect sections. The semiconductor device also includes a second semiconductor chip which has a cavity and a plurality of second electrode pads. The first semiconductor chip and the first bonding wires are received in the cavity. Second bonding wires connect the inter-connect sections exposed from the second semiconductor chip to the leads. Third bonding wires connect the second electrode pads to the leads. The semiconductor device also includes a sealing section.

REFERENCES:
patent: 6627983 (2003-09-01), Tu et al.
patent: 2002/0175401 (2002-11-01), Huang et al.
patent: 2003/0038374 (2003-02-01), Shim et al.
patent: 2005/0194673 (2005-09-01), Kwon et al.
patent: 06-242141 (1994-09-01), None

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