Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2008-01-08

2008-01-08

Nathan, Ha W. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

Reexamination Certificate

active

07317244

ABSTRACT:
In a semiconductor device having a semiconductor chip mounted on a printed circuit board, the semiconductor chip has a plurality of electrodes and the printed circuit board has a plurality of conductive patterns. Metallic plated layers are formed on the electrodes of the semiconductor chip. The metallic plated layers on the electrodes of the semiconductor chip are electrically connected with the conductive patterns of the printed circuit board by metallic wires.

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