Semiconductor device and manufacturing method thereof

Details Semiconductor device and manufacturing method thereof Semiconductor device and manufacturing method thereof

2008-05-13

2008-05-13

Smith, Zandra V. (Department: 2822)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With semiconductor element forming part

C257S686000, C257S666000, C257S777000

Reexamination Certificate

active

07372137

ABSTRACT:
A semiconductor device includes a lower substrate having wiring patterns formed of a plurality of wirings, semiconductor chips located above the lower substrate and electrically connected to the wirings, an intermediate member which seals the semiconductor chips in columnar form and substantially, and a resin board which substantially covers the entire upper surface of the intermediate member. A thermal expansion coefficient of the resin board and a thermal expansion coefficient of the lower substrate are made approximately identical to each other.

REFERENCES:
patent: 5886396 (1999-03-01), Carney et al.
patent: 2003/0027373 (2003-02-01), DiStefano et al.
patent: 2004/0195572 (2004-10-01), Kato et al.
patent: 2004/0207485 (2004-10-01), Kawachi et al.
patent: 2005/0051903 (2005-03-01), Ellsberry et al.
patent: 2006/0214277 (2006-09-01), Saeki
patent: 10-112515 (1998-04-01), None

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