Semiconductor device and manufacturing method therefor

Details Semiconductor device and manufacturing method therefor Semiconductor device and manufacturing method therefor

1985-06-04

1987-09-29

James, Andrew J.

Electricity: conductors and insulators

Feedthrough or bushing

Compression

357 74, 174 52PE, H01L 2306, H01L 2330

Patent

active

046972030

ABSTRACT:
A semiconductor device and a method for manufacturing a semiconductor device of a type having a resin package and a window in the package such as a quartz glass window transparent to ultraviolet rays. A semiconductor chip is bonded onto a surface of a die pad of a lead frame. A softened resin is then extruded from the opposite surface of the die pad through gaps between the die pad and the leads with the extrusion being carried out in an inert gas atmosphere. An inner package member is thus formed surrounding the semiconductor chip. An outer package member, made of a thermosetting resin having a weight ratio of resin to filler less than that of the inner package, is molded around the chip assembly and inner package.

REFERENCES:
Licari, James J., Plastic Coatings for Electronics, McGraw-Hill, N.Y., pp. 14-23, 278-313.

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