Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-05-30
2006-05-30
Coleman, W. David (Department: 2823)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S698000, C257S700000, C257S758000, C257S777000
Reexamination Certificate
active
07053475
ABSTRACT:
An object of the present invention is to make it possible to effect a reliable and compact configuration for a semiconductor device when mounting a plurality of semiconductor elements in a single package, and achieve higher integration and higher functionality more effectively. In a multi-layer wiring board20in which wiring patterns (conductor layers)22, 24, and26, and insulating layers23, 25, and27, are formed alternately in multiple layers on a base substrate, and electrically connections are made between the wiring patterns through via holes VH1and VH2, semiconductor elements30are imbedded and mounted inside the insulating layers23, 25, and27, and the semiconductor elements30are deployed so that they are electrically connected to wiring patterns that are covered by the insulating layers, and so that they are stacked up in a direction perpendicular to the planar dimension of the multi-layer wiring board20.
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Coleman W. David
Nguyen Khiem
Shinko Electric Industries Co. Ltd.
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