Semiconductor device and manufacturing method of them

Details Semiconductor device and manufacturing method of them Semiconductor device and manufacturing method of them

2007-05-01

2007-05-01

Clark, S. V. (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Wire contact, lead, or bond

C257S786000, C257S773000

Reexamination Certificate

active

11005217

ABSTRACT:
A semiconductor device which can meet the requirement for a further increase in pins, which multi-functionalization and faster operation would entail is to be provided. Bonding pads and bonding pads are arranged in a zigzag pattern in a direction along an outer circumference of a main surface of a chip. To focus on power supply-line bonding pads among all the bonding pads, an odd number of bonding pads are to be arranged in a direction of the outer circumference of the main surface between adjoining bonding pads. A greater width is secured for the power supply-line bonding pads than for other bonding pads, and a diameter of wires to be connected to the power supply-line bonding pads is set greater than that of other wires.

REFERENCES:
patent: 6476506 (2002-11-01), O'Connor et al.
patent: 6534879 (2003-03-01), Terui
patent: 2004/0004278 (2004-01-01), Cheng et al.
patent: 2005/0012226 (2005-01-01), Chang et al.
patent: 2005/0029649 (2005-02-01), Kuzawinski et al.
patent: 2005/0184403 (2005-08-01), Inagawa
patent: 2006/0055062 (2006-03-01), Ohta
patent: 2006/0192300 (2006-08-01), Appel et al.
patent: 2006/0197234 (2006-09-01), Pape
patent: 2001-244293 (2001-09-01), None

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