Semiconductor device and manufacturing method of the same

Details Semiconductor device and manufacturing method of the same Semiconductor device and manufacturing method of the same

1996-10-31

1998-07-07

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438106, H01L 2160

Patent

active

057768021

ABSTRACT:
A plurality of connecting leads, each consisting of an internal lead and an external lead, are provided so as to extend inward from a lead frame main body, and are then cut off the lead frame main body. The connecting leads are electrically connected with an aluminum electrode of the semiconductor chip. A plurality of fixing leads, each having a distal end bent toward the semiconductor, are provided so as to extend inward from the lead frame main body and thereafter are cut off the lead frame main body. The semiconductor chip is clamped by the distal ends of the fixing leads. The semiconductor chip, the plural connecting leads and the plural fixing leads are sealed together into a resin package.

REFERENCES:
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patent: 4538210 (1985-08-01), Schaller
patent: 4951121 (1990-08-01), Furukawa et al.
patent: 5038200 (1991-08-01), Hosomi et al.
patent: 5089877 (1992-02-01), Queyssac et al.
patent: 5202288 (1993-04-01), Doering et al.
patent: 5221812 (1993-06-01), Long
patent: 5275975 (1994-01-01), Baudouin et al.
patent: 5358906 (1994-10-01), Lee
"Electronic Packaging and Interconnection Handbook", pp. 7.24-7.25, C. Harper.

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