Semiconductor device, and manufacturing method of the same

Details Semiconductor device, and manufacturing method of the same Semiconductor device, and manufacturing method of the same

1998-04-21

1999-08-10

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

438121, 438106, H01L 2144, H01L 2148, H01L 2150

Patent

active

059372796

ABSTRACT:
To provide a highly reliable semiconductor device which does not suffer from a crack in its package, a semiconductor chip 12 is mounted on a lead frame 11 with a bonding layer 13 between them, and they are sealed with a sealing resin 14. The lead frame 11 has a base member 11a essentially consisting of Cu and an oxide film 11b essentially consisting of an oxide of the base member 11a formed on the base member and having a thickness of about 50 nm or below. By controlling the oxide film 11b to a thickness of about 50 nm or below, an adhesion strength with the sealing resin 14 is improved greatly, so that a package crack does not occur even if a large thermal load is applied in a reflow process for mounting.

REFERENCES:
patent: 5068714 (1991-11-01), Seipler
patent: 5368805 (1994-11-01), Motai
patent: 5637914 (1997-06-01), Tanaka et al.
patent: 5661338 (1997-08-01), Yoo et al.
patent: 5661900 (1997-09-01), McLellan et al.

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