Semiconductor device and manufacturing method of the same

Details Semiconductor device and manufacturing method of the same Semiconductor device and manufacturing method of the same

2006-06-20

2006-06-20

Pham, Hoa (Department: 2814)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Insulative housing or support

C257S734000, C257S735000, C257S736000

Reexamination Certificate

active

07064015

ABSTRACT:
An interposer has a connection electrode formed on the insulating substrate surface, and a solder bump connects with the connection electrode. The insulating substrate surface is made rough where unevenness is formed, and the connection electrode peelable from the insulating substrate surface in a region with which the solder bump is connected by coating surface low active agent.

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