Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate
2006-10-10
2006-10-10
Nguyen, Cuong (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
C257S777000, C257S723000
Reexamination Certificate
active
07119426
ABSTRACT:
In a semiconductor device in which a second semiconductor chip is layered on a first semiconductor chip mounted on a substrate, a mounting-use bonding layer being formed on a reverse surface of the second semiconductor chip with respect to a circuit formation thereof, the mounting-use bonding layer functions as a bonding agent and as a supporting member for supporting protruded part of the second semiconductor chip, which is protruded from an outer edge of the first semiconductor chip. In this semiconductor device, it is possible to bond the second semiconductor chip and the substrate stably by wire bonding.
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patent: 6353263 (2002-03-01), Dotta et al.
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U.S. Appl. No. 10/428,013, filed May 2003, Fukui et al.
Korean Office Action and English translation thereof mailed Oct. 28, 2005 in corresponding Korean application No. 2003-78006.
Fukui Yasuki
Miyata Koji
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