Semiconductor device and manufacturing method of...

Details Semiconductor device and manufacturing method of... Semiconductor device and manufacturing method of...

2006-07-18

2006-07-18

Luu, Chuong Anh (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S107000, C438S125000, C438S124000, C438S615000

Reexamination Certificate

active

07078270

ABSTRACT:
A manufacturing method of a semiconductor device includes a support member for fixing a semiconductor chip, the support member being formed between leads without applying stress to the leads. The semiconductor device includes a plurality of leads composing a lead frame, a resin island (a support member) that is formed between the leads, a semiconductor chip that is fixed on the resin island and is electrically connected to the leads by bonding wires, and sealing resin for partially sealing the semiconductor chip, the bonding wire, and the lead by resin, wherein a liquid cured resin is formed (filled) between the leads to form the resin island (the support member).

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patent: 6063139 (2000-05-01), Fukaya
patent: 2002/0084518 (2002-07-01), Hasebe et al.
patent: 2004/0004275 (2004-01-01), Chen et al.
patent: 5-75009 (1993-03-01), None
patent: 407335982 (1995-12-01), None
patent: 11-31778 (1999-02-01), None

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