Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With large area flexible electrodes in press contact with...
Reexamination Certificate
2008-11-21
2011-12-13
Trinh, Hoa B (Department: 2893)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With large area flexible electrodes in press contact with...
C257SE23078
Reexamination Certificate
active
08076769
ABSTRACT:
A semiconductor device includes a semiconductor element; a plate member disposed opposite to an electronic-circuit forming portion of the semiconductor element; and an elastic body arranged in a compressed state between the semiconductor element and the plate member, wherein the elastic body includes at least one first protruding portion at one end in an extension direction of the elastic body, the first protruding portion being formed opposite to the electronic-circuit forming portion of the semiconductor element, and the semiconductor element and the plate member are fastened by an adhesive agent.
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patent: 11-31208 (1999-02-01), None
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patent: 2004-62572 (2004-02-01), None
Kumagaya Yoshikazu
Nishimura Takao
Fujitsu Semiconductor Limited
Trinh Hoa B
Westerman Hattori Daniels & Adrian LLP
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