Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate
2008-09-09
2010-11-16
Blum, David S (Department: 2813)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Wire contact, lead, or bond
C438S121000, C257SE21001, C257SE23141
Reexamination Certificate
active
07834465
ABSTRACT:
In a technique connecting between bonding pads of semiconductor chips, contact between wires is prevented. A semiconductor device of the present embodiment is provided with a semiconductor chip1in which a plurality of bonding pads3are arranged in line, a semiconductor chip2in which a plurality of bonding pads4are arranged in line substantially parallel to the plurality of bonding pads3, and a plurality of wires7which connect the bonding pads3to the bonding pads4respectively. At least one of the wires7is bended with respect to a reference straight line S which passes through the bonding pad3and the bonding pad4which are connected by the wire7. The bended wire is extended out from the bonding pad4in a certain direction in which a distance between the bended wire and an adjacent wire which is adjacent to the bended wire is larger than a distance between the reference straight line of the bended wire and the reference straight line of the adjacent wire.
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Blum David S
McGinn IP Law Group PLLC
NEC Electronics Corporation
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