Semiconductor device and manufacturing method for the same

Details Semiconductor device and manufacturing method for the same Semiconductor device and manufacturing method for the same

2006-06-13

2006-06-13

Cao, Phat X. (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S778000

Reexamination Certificate

active

07061097

ABSTRACT:
There is here disclosed a semiconductor device comprising a semiconductor element, a first substrate disposed to face one side of the element, being provided first internal wirings on a main surface, and being provided first external wirings connected to the respective first internal wirings on another main surface, and a second substrate formed to be larger than the element by a material having flexibility, being disposed to face another side of the element, being provided second internal wirings having one-end portions extended to edges of a main surface, and the one-end portions connected to the first internal wirings with being bent toward the first substrate together with the edges, being mounted the element having an electrode connected to some of the second internal wirings on the main surface, and being provided external terminals connected to some of the second internal wirings on a middle of another main surface.

REFERENCES:
patent: 6724061 (2004-04-01), Murata
patent: 6822323 (2004-11-01), Kim et al.
patent: 11-186492 (1999-07-01), None
patent: 2000-68444 (2000-03-01), None
patent: 2001-332681 (2001-11-01), None
patent: 2002-151644 (2002-05-01), None
patent: 2003-86733 (2003-03-01), None
Notification of Reasons for Rejection (Office Action) for Japanese Patent Application No. 2004-006787, mailed Jan. 17, 2006 and English translation thereof.

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