Semiconductor device and manufacturing method for the same

Details Semiconductor device and manufacturing method for the same Semiconductor device and manufacturing method for the same

2006-04-25

2006-04-25

Dang, Trung (Department: 2823)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C438S114000, C257S620000, C257S621000

Reexamination Certificate

active

07033863

ABSTRACT:
A semiconductor device, comprising:a semiconductor substrate providing a semiconductor element; anda hard film which covers a part or the entirety of a side of the semiconductor substrate and which has top and bottom surfaces in approximately the same planes as those of the top and bottom surfaces of the semiconductor substrate,wherein the side of the semiconductor substrate covered with the hard film is processed so as to be perpendicular or substantially perpendicular to the surface of the semiconductor substrate.

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