Semiconductor device and manufacturing method for same

Details Semiconductor device and manufacturing method for same Semiconductor device and manufacturing method for same

2007-04-03

2007-04-03

Ho, Tu-Tu (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

With shielding

With means to shield device contained in housing or package...

C257S659000, C257S099000, C257SE33056

Reexamination Certificate

active

10791750

ABSTRACT:
A semiconductor device in which semiconductor chip(s) is or are mounted onto substrate(s) incorporating patterned wiring and the entirety or entireties has or have been sealed with resin(s), wherein by forming electrically conductive pattern(s) for shielding at end face(s) at top(s) of substrate(s) and attaching such electrically conductive pattern(s) to region(s) of ground plane pattern(s) on circuit board(s) of apparatus(es) which is or are provided with such semiconductor device(s), it is possible to shield semiconductor device(s) even without use of shield case(s). In such case, by applying material(s) possessing good shielding characteristics, e.g., gold plating, over electrically conductive pattern(s), it is possible to increase sensitivity with respect to electromagnetic noise and improve shielding effect (anti-electromagnetic-noise effect).

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patent: 2001-127310 (2001-05-01), None
patent: 2003-124498 (2003-04-01), None

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