Semiconductor device and manufacturing method for same

Details Semiconductor device and manufacturing method for same Semiconductor device and manufacturing method for same

2005-09-13

2005-09-13

Quach, T. N. (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Lead frame

C257S675000, C257S676000, C257S680000, C257S687000

Reexamination Certificate

active

06943433

ABSTRACT:
To provide a light emitting device having a high reliability wherein no resin burrs occur, The semiconductor device comprises a semiconductor element, a package having a recess for housing the semiconductor element and a mold member for sealing the semiconductor element in the recess and the package comprises lead electrodes and a package support part supporting the lead electrodes so that main surfaces of the tip portions of the lead electrodes are exposed from the bottom surface of the recess.

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