Semiconductor device and manufacturing method

Details Semiconductor device and manufacturing method Semiconductor device and manufacturing method

1998-03-20

2000-02-08

Picardat, Kevin M.

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438107, 438121, 438125, H01L 2140

Patent

active

060227575

ABSTRACT:
A semiconductor device with advanced functions and an improved factor of effective mounting area comprises a semiconductor chip on which an IC or the like is formed; a plurality of external connector electrodes having a block form which are connected with a plurality of electrodes of the semiconductor chip, arranged near the circumference of the semiconductor chip at a prescribed distance from the semiconductor chip, and composed of a substrate other than the semiconductor chip; a wiring substrate which is arranged face to face with the semiconductor chip and the external connector electrodes, and a wiring pattern for electrically connecting each electrode of the semiconductor chip with the external connector electrodes is formed on the surface. Connectors connect the wiring pattern with both electrodes of the semiconductor chip and external connector electrodes and form a prescribed space between the wiring substrate and the semiconductor chip. A method of manufacturing such devices is also disclosed.

REFERENCES:
patent: 5143865 (1992-09-01), Hideshima et al.
patent: 5629241 (1997-05-01), Matloubian et al.
patent: 5786230 (1998-07-01), Anderson et al.
patent: 5786636 (1998-07-01), Takahashi
patent: 5866443 (1999-02-01), Pogge et al.

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