Semiconductor device, and life prediction circuit and life...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element

Reexamination Certificate

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Reexamination Certificate

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08004304

ABSTRACT:
A life prediction wire14is connected to an emitter-wire bonding pad2of a semiconductor device1. Wire deterioration is detected by checking whether or not an electric current flows from the life prediction wire14to the emitter-wire bonding pad2. Thus, by directly checking a deterioration state of the semiconductor device, the life of the semiconductor device is predicted.

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patent: WO 2005/038918 (2005-04-01), None
Office Action issued Feb. 26, 2007, in German Application No. 10 2006 049 211.0-33.

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