Semiconductor device and lead frame used therefor

Details Semiconductor device and lead frame used therefor Semiconductor device and lead frame used therefor

1987-08-12

1989-02-28

LaRoche, Eugene R.

357 81, H01L 2348, H01L 2302

Patent

active

048090530

ABSTRACT:
A plastic molded semiconductor device which includes a metal lead frame having a heat spreader extending from a stage on which a semiconductor chip is mounted. The heat spreader is located between a periphery of the stage and inner leads located opposite to the stage. The chip is electrically connected to the inner leads by an insulative film having a plurality of conductive patterns.

REFERENCES:
patent: 3868725 (1975-02-01), DeGraaff
patent: 3930115 (1975-12-01), Uden et al.
patent: 4514750 (1985-04-01), Adams
patent: 4701363 (1987-10-01), Barber

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