Semiconductor device and lead frame therefor

Details Semiconductor device and lead frame therefor Semiconductor device and lead frame therefor

1996-12-18

1998-05-19

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Encapsulated

257666, 257674, 257793, 438127, H01L 23495, H01L 2328, H01L 2329

Patent

active

057539774

ABSTRACT:
A semiconductor device includes a semiconductor chip; leads including first inner leads and second inner leads extending substantially radially from a central point of the semiconductor chip; electrical conductors electrically connecting the semiconductor chip to the lead frame; and an encapsulating resin encapsulating the semiconductor chip, the electrical conductors, and the inner leads, Each of the first inner leads has a first inner end located proximate the central point and each of the second inner leads has a second inner end located farther from the central point than the first inner ends. The first and second inner leads are alternatingly arranged. Thus, at least some of the inner leads extend under the semiconductor chip, providing heat conducting paths. The lead frame includes a frame and leads supported by the frame and including first inner leads and second inner leads extending substantially radially toward a central point of the frame. The lead frame is applicable for mounting semiconductor chips of different outer dimensions and a necessary clearance is maintained between the leads.

REFERENCES:
patent: 5021865 (1991-06-01), Takahashi et al.
patent: 5569964 (1996-10-01), Ikebe

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