Semiconductor device and its manufacturing method, and...

Details Semiconductor device and its manufacturing method, and... Semiconductor device and its manufacturing method, and...

2007-02-20

2007-02-20

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S106000, C438S108000, C438S612000, C257SE21519

Reexamination Certificate

active

10973991

ABSTRACT:
A method of manufacturing a semiconductor device is provided including depressing a bonding tool having a concave portion toward a wiring board with a semiconductor chip disposed within the concave portion, pressing the semiconductor chip with a bottom face of the concave portion, fluidizing a resin provided between the semiconductor chip and the wiring board, and filling a lateral space proximate the semiconductor chip within the concave portion with the resin, and curing the resin.

REFERENCES:
patent: 2003/0052419 (2003-03-01), Ujiie et al.
patent: 2004/0235221 (2004-11-01), Taguchi et al.
patent: 04-171950 (1992-06-01), None
patent: 06-151509 (1994-05-01), None
patent: 2000-164610 (2000-06-01), None
patent: 2000-174039 (2000-06-01), None
patent: 2001-127105 (2001-05-01), None
Communication from Japanese Patent Office regarding counterpart application.
Communication from Japanese Patent Office regarding related application.

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