Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Patent
1994-08-24
1996-03-12
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Multiple housings
257685, 257666, H01L 2302, H01L 23495
Patent
active
054989027
ABSTRACT:
In a semiconductor device is provided a semiconductor element 22 encapsulated in a package 26. The connection area 29 used to connect an external structure, such as a heat-dissipating plate 30 or another semiconductor device, is installed in either the die pad 23 used for mounting the semiconductor element or inner leads 24 that are electrically connected to the semiconductor element. The connection area is integrated with the external structure via linking holes 28 that have been formed in the package. By combining a packaged and completed semiconductor device with various types of external structures, it becomes possible to expand or enhance the function of the overall semiconductor device, or to lower its cost.
REFERENCES:
patent: 5376825 (1994-12-01), Tukamoto et al.
Clark S. V.
Seiko Epson Corporation
Wojciechowicz Edward
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