Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate
2006-07-04
2006-07-04
Coleman, W. David (Department: 2823)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Assembly of plural semiconductive substrates each possessing...
C438S110000, C438S127000, C438S690000, C438S508000
Reexamination Certificate
active
07071028
ABSTRACT:
A semiconductor device in which a semiconductor chip (3) is mounted on a substrate (2), comprising a substrate having electrodes (7, 8) for substrate-to-substrate connection disposed on both sides of the substrate and connected via a through hole (9), a semiconductor chip having an electrode connected to a wiring pattern arranged on the substrate and having a flat-cut face opposite to the face where the electrode is provided, a bump (4) for substrate-to-substrate connection provided on the electrode for substrate-to-substrate connection and having a flat-cut face opposite to the face facing the substrate, a sealing resin body (5) provided on the substrate, used for sealing the semiconductor chip and the bump for substrate-to-substrate, and having a flat-cut face opposite to the face facing the substrate, wherein the flat-cut face (3a) of the semiconductor chip, the flat-cut face (4a) of the bump for substrate-to-substrate, and the flat-cut face (5a) or the sealing resin body are flush with one another, and the semiconductor chip and the bump for disk recording medium except for the flat-cut faces are scaled in the sealing body.
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Honda Manabu
Kato Masuo
Koike Toshihiko
Coleman W. David
Lerner David Littenberg Krumholz & Mentlik LLP
Nguyen Khiem
Sony Corporation
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