Semiconductor device and its manufacturing method

Details Semiconductor device and its manufacturing method Semiconductor device and its manufacturing method

2005-10-11

2005-10-11

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Including adhesive bonding step

C438S125000

Reexamination Certificate

active

06953709

ABSTRACT:
A semiconductor device having area array bump electrodes suitable for flip chip packaging is disclosed. A semiconductor chip with wire bonding electrodes arranged along peripheral edges thereof is provided, then gold wire bump electrodes are formed over the wire bonding electrodes, and thereafter a wiring tape substrate is superimposed on the semiconductor chip and is bonded thereto with an adhesive. On a back surface of the wiring tape substrate are formed wiring connections correspondingly to the electrodes. Further, at the time of bonding with use of the adhesive, convex tips of the gold wire bump electrodes formed respectively on the electrodes of the semiconductor chip pierce through the adhesive to connect the gold wire bump electrodes and the connections electrically with each other. On a surface of the wiring tape substrate are formed area array bump electrodes, whose pitch is larger than the pitch of the electrodes formed on the semiconductor chip.

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patent: 6046495 (2000-04-01), Urushima
patent: 9-223759 (1997-08-01), None
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patent: 2000-58594 (2000-02-01), None
patent: 2001-168152 (2001-06-01), None

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