Semiconductor device and its manufacturing method

Details Semiconductor device and its manufacturing method Semiconductor device and its manufacturing method

2008-01-22

2008-01-22

Estrada, Michelle (Department: 2823)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257S691000, C257S686000, C257SE23010, C257SE23060, C257SE21511

Reexamination Certificate

active

07321165

ABSTRACT:
In a semiconductor device in which a plurality of substrates each mounting a semiconductor chip are stacked, one ends of the leads formed on the substrates are connected to the semiconductor chip and the other ends thereof are connected to connection terminals of the substrates. At least one of the leads are branched into two or more in the vicinity of the connection terminals, and one ends of the branched leads are connected to the connection terminals. A technique for sorting good products is performed in a state in which the chips are mounted on the substrates.

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