Semiconductor device and its manufacturing method

Fishing – trapping – and vermin destroying

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

437191, 437233, 437 48, 437 52, H01L 2120

Patent

active

053568303

ABSTRACT:
A semiconductor device and its manufacturing method are provided in which an epitaxial silicon layer is formed by a selective epitaxial growth method over a semiconductor substrate and a polysilicon layer is formed by an ordinary deposition method on the epitaxial silicon layer and these layers and are formed over a semiconductor device in a continuous process within the same furnace for a CVD apparatus.

REFERENCES:
patent: 4141765 (1979-02-01), Druminski
patent: 4438728 (1984-03-01), Cannella et al.
patent: 4497683 (1985-02-01), Celler et al.
patent: 4703554 (1987-11-01), Havemann
patent: 4707457 (1987-11-01), Erb
patent: 4722908 (1988-02-01), Burton
patent: 4749441 (1988-06-01), Christenson et al.
patent: 4754313 (1988-06-01), Takemae et al.
patent: 4772570 (1988-09-01), Kanai et al.
patent: 4786615 (1988-11-01), Liaw et al.
patent: 4824799 (1989-04-01), Komatsu
patent: 4882299 (1989-11-01), Freeman et al.
patent: 5021357 (1991-06-01), Taguchi et al.
Crabbe et al., Mat. Res. Soc. Symp. Proc., vol. 106, Materials Research Society (1988), pp. 247-252.
Extended Abstracts of the 18th (1986 International) Conference on Solid State Devices and Materials, pp. 713-714, Tokyo, Japan; L. Karapiperis et al., "Selective Epitaxial Growth of Si and in Situ Deposition of Amorphous- or Poly-Si for Recrystallization Purposes".
Extended Abstracts/Electrochemical Society, vol. 87-2, 1987, abstract 1086, pp. 1512-1513, Princeton, N.J., U.S.; A. S. Yue et al., "Growth Mechanism of Episilicon Film on SiO.sub.2 Surface".

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and its manufacturing method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and its manufacturing method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and its manufacturing method will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-2372004

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.