Semiconductor device and its manufacture

Details Semiconductor device and its manufacture Semiconductor device and its manufacture

1986-07-01

1989-04-18

Pellinen, A. D.

Electricity: electrical systems and devices

Electrostatic capacitors

Fixed capacitor

357 81, 357 72, 174 522, 361395, 29841, 29844, H02B 100

Patent

active

048232343

ABSTRACT:
A semiconductor device of the kind wherein one or more semiconductor chips are housed in a plug-in type package. The package is being molded with a printed wiring substrate, head portions of terminals, and a heat sink for semiconductor chip attachment as an integral part of the package. The one surface of the heat sink is being bared from one side of the package, and the semiconductor chips are being mounted on the other surface of the heat sink facing to the opening of the substrate.

REFERENCES:
patent: 3781596 (1973-12-01), Galli et al.
patent: 3846825 (1974-11-01), Budde
patent: 4338621 (1982-07-01), Braun
patent: 4385202 (1983-05-01), Spinelli et al.
patent: 4424251 (1984-01-01), Sugishita et al.
patent: 4547834 (1985-10-01), Dumont et al.
patent: 4561010 (1985-12-01), Ogihari et al.
patent: 4620215 (1986-10-01), Lee
patent: 4628149 (1986-12-01), Dohya
patent: 4630172 (1986-12-01), Stenerson et al.
patent: 4710796 (1987-12-01), Ikeya et al.
I.B.M. Technical Disclosure, Kerjilian, et al., Jul. 1975 "Thermally Enhanced Multilayer Ceramic Substrate Structure" vol. 18 No. 2, p. 353.

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