Semiconductor device and its manufacture

Active solid-state devices (e.g. – transistors – solid-state diode – Regenerative type switching device – Combined with field effect transistor

Reexamination Certificate

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C257S618000, C257SE21506

Reexamination Certificate

active

07847316

ABSTRACT:
A reliable semiconductor device is provided which comprises lower and upper IGBTs1and2preferably bonded to each other by solder, and a wire strongly connected to lower IGBT1. The semiconductor device comprises a lower IGBT1, a lower electrode layer5secured on lower IGBT1, an upper electrode layer6secured on lower electrode layer5, an upper IGBT2secured on upper electrode layer6, and a solder layer7which connects upper electrode layer6and upper IGBT2. Lower and upper electrode layers5and6are formed of different materials from each other, and upper electrode layer6has a notch36to partly define on an upper surface5aof lower electrode layer5a bonding region15exposed to the outside through notch36so that one end of a wire8is connected to bonding region15. Upper electrode layer6can be formed of one material superior in soldering, and also, lower electrode layer5can be formed of another material having a high adhesive strength to wire8.

REFERENCES:
patent: 6031279 (2000-02-01), Lenz
patent: 6055148 (2000-04-01), Grover
patent: 6577008 (2003-06-01), Lam et al.
patent: 2002/0024147 (2002-02-01), Jung et al.
patent: 2002/0113247 (2002-08-01), Magri et al.
patent: 2006/0202228 (2006-09-01), Kanazawa
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patent: 11008385 (1999-01-01), None
patent: 2001284525 (2001-10-01), None
patent: 2005072519 (2005-03-01), None
patent: 2007007445 (2007-01-01), None

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