Semiconductor device and its manufacture

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

438734, 438957, 438962, 438738, 438739, 438585, H01L 2128, H01L 21302, H01L 3213

Patent

active

061211575

ABSTRACT:
A substrate has an insulating surface; a fine wire region disposed on the insulating surface of the substrate and extending long in one direction; a first insulating film formed on the fine wire region at least at a partial area along the longitudinal direction of the fine wire region; and a first micro box region formed on the first insulating film over the fine wire region at a partial area along the longitudinal direction of the fine wire region a semiconductor device. The semiconductor device has a fine wire region and a micro box region to realize control of a single electron level. The manufacturing method for the semiconductor device is also disclosed.

REFERENCES:
patent: 4983540 (1991-01-01), Yamaguchi et al.
patent: 5104824 (1992-04-01), Clausen et al.
patent: 5372675 (1994-12-01), Wakabayashi et al.
patent: 5376225 (1994-12-01), Wakabayashi et al.
patent: 5562802 (1996-10-01), Okada et al.
patent: 5600163 (1997-02-01), Yano et al.
patent: 5604154 (1997-02-01), Takahashi et al.
patent: 5691552 (1997-11-01), Oyama
patent: 5714766 (1998-02-01), Chen et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and its manufacture does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and its manufacture, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and its manufacture will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1072782

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.