Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
Patent
1998-12-21
2000-09-19
Wilczewski, Mary
Semiconductor device manufacturing: process
Chemical etching
Vapor phase etching
438734, 438957, 438962, 438738, 438739, 438585, H01L 2128, H01L 21302, H01L 3213
Patent
active
061211575
ABSTRACT:
A substrate has an insulating surface; a fine wire region disposed on the insulating surface of the substrate and extending long in one direction; a first insulating film formed on the fine wire region at least at a partial area along the longitudinal direction of the fine wire region; and a first micro box region formed on the first insulating film over the fine wire region at a partial area along the longitudinal direction of the fine wire region a semiconductor device. The semiconductor device has a fine wire region and a micro box region to realize control of a single electron level. The manufacturing method for the semiconductor device is also disclosed.
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Fujitsu Limited
Lin Yung A.
Wilczewski Mary
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