Semiconductor device manufacturing: process – Chemical etching – Altering etchability of substrate region by compositional or...
Reexamination Certificate
2004-11-19
2008-08-26
Baumeister, Bradley (Department: 2891)
Semiconductor device manufacturing: process
Chemical etching
Altering etchability of substrate region by compositional or...
C257SE21252, C257SE21279
Reexamination Certificate
active
07416988
ABSTRACT:
A method of fabricating a semiconductor device includes the steps of modifying a damaged layer containing carbon and formed at a semiconductor surface by exposing the damaged layer to oxygen radicals to form a modified layer, and removing the modified layer by a wet etching process, wherein the modifying step is conducted by adding an active specie of an element that would obstruct formation of double bond between a Si atom and an oxygen atom by causing a chemical bond with Si atoms on the semiconductor surface.
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Anya Igwe U.
Baumeister Bradley
Fujitsu Limited
Westerman, Hattori, Daniels & Adrian , LLP.
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