Semiconductor device and fabrication process therefor

Details Semiconductor device and fabrication process therefor Semiconductor device and fabrication process therefor

2005-08-30

2005-08-30

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S122000

Reexamination Certificate

active

06936499

ABSTRACT:
A semiconductor device which includes: a semiconductor chip bonded to a surface of a solid device; and a stiffener surrounding the periphery of the semiconductor chip. A surface of the stiffener opposite from the solid device is generally flush with a surface of the semiconductor chip opposite from the solid device.

REFERENCES:
patent: 5477082 (1995-12-01), Buckley
patent: 5574285 (1996-11-01), Marion et al.
patent: 5909056 (1999-06-01), Mertol
patent: 5909057 (1999-06-01), McCormick et al.
patent: 5973389 (1999-10-01), Culnane et al.
patent: 6066512 (2000-05-01), Hashimoto
patent: 6114763 (2000-09-01), Smith
patent: 6140707 (2000-10-01), Plepys
patent: 6166434 (2000-12-01), Desai
patent: 6326696 (2001-12-01), Horton
patent: 6400037 (2002-06-01), Omizo
patent: 6507116 (2003-01-01), Caletka et al.
patent: 5883430 (2003-02-01), Caletka et al.
patent: 6528394 (2003-03-01), Lee
patent: 2002/0060084 (2002-05-01), Hilton et al.
patent: 2003/0034569 (2003-02-01), Caletka et al.
patent: 2003/0100142 (2003-05-01), Shin et al.
patent: 11284097 (1999-10-01), None
patent: 11307592 (1999-11-01), None
patent: 2001267474 (2001-09-01), None
patent: WO 99/57764 (1999-11-01), None

Affiliated with

Also associated with

Rating

Semiconductor device and fabrication process therefor does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and fabrication process therefor, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and fabrication process therefor will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3494141