Semiconductor device and fabrication method thereof

Details Semiconductor device and fabrication method thereof Semiconductor device and fabrication method thereof

2011-08-09

2011-08-09

Estrada, Michelle (Department: 2829)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

C438S455000, C438S613000, C438S615000, C438S616000, C438S745000, C257SE21503, C257SE21508, C257SE21510

Reexamination Certificate

active

07993970

ABSTRACT:
A semiconductor device and a method of manufacturing the same are disclosed. The method is carried out by forming solder pads on a substrate by wet etching, flipping a semiconductor chip having a plurality of connection bumps formed on an active surface of the semiconductor chip for the connection bumps to be mounted by compression on the solder pads of the substrate correspondingly, at a temperature of the compression between the connection bumps and the solder pads lower than the melting points of the solder pads and the connection bumps, so as to allow the semiconductor chip to be engaged with and electrically connected to the substrate through the connection bumps and the solder pads, thereby enhancing the bonding strength of the solder pads and the connection bumps and increasing the fabrication reliability.

REFERENCES:
patent: 2002/0050652 (2002-05-01), Akram et al.
patent: 2003/0001286 (2003-01-01), Kajiwara et al.
patent: 2004/0164426 (2004-08-01), Pai et al.
patent: 2004/0212101 (2004-10-01), Pendse

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