Semiconductor device and fabrication method of the same

Details Semiconductor device and fabrication method of the same Semiconductor device and fabrication method of the same

2006-05-16

2006-05-16

Andujar, Leonardo (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Chip mounted on chip

C257S688000

Reexamination Certificate

active

07045899

ABSTRACT:
A semiconductor device includes semiconductor chips, a first conductive pattern, an external terminal and an encapsulating resin. Each of the semiconductor chips has a front side formed with integrated circuits and a back side. The semiconductor chips are stacked each other. The first conductive pattern electrically connects the integrated circuits. The external terminal is electrically connected to the first conductive pattern. The encapsulating resin encapsulates the semiconductor chips and the first conductive pattern.

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