Semiconductor device and fabrication method

Details Semiconductor device and fabrication method Semiconductor device and fabrication method

2011-08-23

2011-08-23

Luu, Chuong A (Department: 2813)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S777000, C257SE23101

Reexamination Certificate

active

08004074

ABSTRACT:
A semiconductor device, in which a semiconductor element is mounted on one side of a circuit board that is made up from an insulating layer and a wiring layer, includes metal posts provided on the side of the circuit board on which the semiconductor element is mounted; and a sealing layer provided on the side of the circuit board on which the semiconductor element is mounted such that the semiconductor element is covered and such that only portions of the metal posts are exposed.

REFERENCES:
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patent: 6759738 (2004-07-01), Fallon et al.
patent: 2005/0009243 (2005-01-01), Taniguchi
patent: 2007/0045867 (2007-03-01), Machida
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patent: 2004-327856 (2004-11-01), None
patent: 2005-19814 (2005-01-01), None
patent: 2005-45251 (2005-02-01), None
patent: 2007-42762 (2007-02-01), None
Japanese Official Action—2007-105852—Jun. 15, 2011.

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