Semiconductor device and fabrication method

Details Semiconductor device and fabrication method Semiconductor device and fabrication method

1994-07-27

1997-11-18

Saadat, Mahshid D.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Smart card package

361737, 235492, 257649, H01L 2302, H05K 114, G06K 1906

Patent

active

056891369

ABSTRACT:
A thin-film semiconductor device comprising at least a semiconductor element and a wiring is disclosed. A thin film of a protective insulating material is formed on the lower surface of the semiconductor element, and a substrate is bonded on the lower surface of the thin film. A method for fabricating the thin-film semiconductor device is also disclosed, in which a thin-film semiconductor circuit is formed on a silicon-on-insulator wafer, the silicon substrate on the reverse side of the silicon-on-insulator wafer is etched off, a thin-film semiconductor chip is formed and attached to the substrate, and the thin-film semiconductor chip and the substrate are wired to each other by printing.

REFERENCES:
patent: 4409471 (1983-10-01), Aigo
patent: 4603249 (1986-07-01), Hoppe et al.
patent: 4931853 (1990-06-01), Ohuchi et al.
patent: 5155068 (1992-10-01), Tada
patent: 5362667 (1994-11-01), Linn et al.
"Organic Chemistry" 3rd Edition, Morrison et al., chapter 32, p. 1027.
"Electronic Packaging and Interconnection Handbook", Harper, chapter one, 1.2.1.8; pp. 1.10-1.11.

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