Semiconductor device and fabricating method thereof

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S459000, C438S027000, C438S030000, C438S614000, C438S626000, C438S672000

Reexamination Certificate

active

07084503

ABSTRACT:
The present invention provides a semiconductor device in which occurrence of disclination caused by steps in a contact portion and steps between pixel electrodes is prevented. A method of fabricating a semiconductor device according to the invention includes forming an insulating film2on an electrode1aso as to cover the electrode; forming contact holes2aand2blocated on the electrode and concave portions2cand2dconnected to the contact hole; embedding a conductive film8in the contact hole and the concave portion and forming a conductive film8on the insulating film; and applying the CMP polishing or the etching-back to the conductive film, and thereby forming a pixel electrode made of the conductive films8aand8bembedded in the contact hole and the concave portion.

REFERENCES:
patent: 4789648 (1988-12-01), Chow et al.
patent: 5148259 (1992-09-01), Kato et al.
patent: 5250465 (1993-10-01), Iizuka et al.
patent: 5536950 (1996-07-01), Liu et al.
patent: 5706064 (1998-01-01), Fukunaga et al.
patent: 5948705 (1999-09-01), Jun
patent: 5976393 (1999-11-01), Abe
patent: 5990542 (1999-11-01), Yamazaki
patent: 6030904 (2000-02-01), Grill et al.
patent: 6043149 (2000-03-01), Jun
patent: 6057227 (2000-05-01), Harvey
patent: 6081305 (2000-06-01), Sato et al.
patent: 6097453 (2000-08-01), Okita
patent: 6130156 (2000-10-01), Havemann et al.
patent: 6163055 (2000-12-01), Hirakata et al.
patent: 6291334 (2001-09-01), Somekh
patent: 6326249 (2001-12-01), Yamazaki et al.
patent: 6365502 (2002-04-01), Paranjpe et al.
patent: 6365506 (2002-04-01), Chang et al.
patent: 6468844 (2002-10-01), Yamazaki et al.
patent: 6524947 (2003-02-01), Subramanian et al.
patent: 6556264 (2003-04-01), Hirakata et al.
patent: 6806192 (2004-10-01), Lin et al.
patent: 6856360 (2005-02-01), Higuchi et al.
patent: 2002/0000613 (2002-01-01), Ohtani et al.
patent: 2003/0193627 (2003-10-01), Hirakata et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and fabricating method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3661693

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.