Semiconductor device and fabricating method thereof

Semiconductor device manufacturing: process – Making device or circuit emissive of nonelectrical signal – Mesa formation

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257SE21090, C438S300000, C438S044000

Reexamination Certificate

active

07741138

ABSTRACT:
A semiconductor device and fabricating method thereof are disclosed, by which channel mobility is enhanced and by which effect of flicker noise can be minimized. Embodiments relate to a method of fabricating a semiconductor device which includes forming a first epi-layer over a substrate, forming a second epi-layer over the first epi-layer, forming a gate electrode over the second epi-layer, forming a spacer over both sides of the gate electrode, etching an area adjacent both sides of the spacer to a depth of the substrate, forming an LDD region in a region under the spacer, and forming a third epi-layer for a source/drain region over the etched area adjacent both of the sides of the spacer.

REFERENCES:
patent: 7132719 (2006-11-01), Koh
patent: 7179696 (2007-02-01), Chakravarthi et al.
patent: 7211859 (2007-05-01), Cho
patent: 7432559 (2008-10-01), Lai et al.
patent: 2003/0215992 (2003-11-01), Sohn et al.
patent: 2006/0220114 (2006-10-01), Miyashita et al.
patent: 2007/0131969 (2007-06-01), Sanuki et al.
patent: 2008/0242032 (2008-10-01), Chakravarthi et al.
patent: 10-2006-0072411 (2006-06-01), None
patent: 10-2006-0079356 (2006-07-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and fabricating method thereof does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and fabricating method thereof, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and fabricating method thereof will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-4156467

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.