Semiconductor device and electronic apparatus equipped with...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead

Reexamination Certificate

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C257S503000, C257S692000, C257S738000, C257S774000, C257S778000, C257S784000, C257S786000, C257SE23005, C257SE23011, C257SE23020, C257SE23021, C257SE23067, C257SE23069, C257SE23070, C257SE23079

Reexamination Certificate

active

07944040

ABSTRACT:
A semiconductor device comprises an IC chip body and a package substrate that has thereon many external electrodes arranged in a two-dimensional grid configuration. Groups of signal lines that are likely to emit noise (noisy signal lines) are separated and spaced apart from groups of signal lines that are susceptible to noise (noise susceptible signal lines). Each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated IC pad group separated and spaced apart from other IC pad groups. Further, each of the noisy signal lines and noise susceptible signal lines is connected to an associated member of an associated external electrode group selected from the multiplicity of external electrodes arranged in a two-dimensional grid configuration on the package substrate. Thus, groups of potentially interfering signal lines are mutually separated and spaced apart from one another, thereby suppressing the noise.

REFERENCES:
patent: 6838773 (2005-01-01), Kikuchi et al.
patent: 6936911 (2005-08-01), Horimoto
patent: 7141819 (2006-11-01), Maruko
patent: 2004/0017008 (2004-01-01), Ueda
patent: 2004/0032359 (2004-02-01), Lebedev
patent: 2004/0145061 (2004-07-01), Kanai et al.
patent: 2005/0040536 (2005-02-01), Buffet et al.
patent: 10-050922 (1998-02-01), None
patent: 507339 (2002-10-01), None
patent: 517357 (2003-01-01), None

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