Semiconductor device and drive circuit using the...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Junction field effect transistor

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S707000

Reexamination Certificate

active

06956255

ABSTRACT:
A high-speed bipolar transistor is provided which is improved in the effect of heat radiation without increasing the substrate capacitance. The heat radiation connection between a base region and a silicon substrate includes a p+extrinsic base polysilicon electrode and a polysilicon layer buried in an isolation groove with a very thin silicon dioxide side wall. Accordingly, the heat generated at the base is radiated through this path to the silicon substrate. Further, the film thickness of the silicon dioxide on the inner wall of the isolation groove is sufficiently increased compared with previous structures to prevent an increase in the substrate capacitance. Consequently, there can be obtained a bipolar transistor which operates at high speed, and is improved in the effect of heat radiation without increasing the substrate capacitance.

REFERENCES:
patent: 3986196 (1976-10-01), Decker et al.
patent: 4794093 (1988-12-01), Tong et al.
patent: 5313094 (1994-05-01), Beyer et al.
patent: 6222254 (2001-04-01), Liang et al.
patent: 6355950 (2002-03-01), Livengood et al.
patent: 7-086298 (1995-03-01), None
patent: 07-086298 (1995-03-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and drive circuit using the... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and drive circuit using the..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and drive circuit using the... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3474295

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.