Semiconductor device and communication method

Details Semiconductor device and communication method Semiconductor device and communication method

2011-07-19

2011-07-19

Ha, Nathan W (Department: 2814)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

C257SE23023

Reexamination Certificate

active

07982303

ABSTRACT:
A semiconductor chip is disposed on a first surface of a mounting board with its active surface upward. An inductor is provided at the active surface side, that is, at the surface side of the semiconductor chip not facing the mounting board in order to perform communication between the semiconductor chip and the outside. A sealing resin layer is formed on the first surface of the mounting board in order to seal the semiconductor chip. In addition, a recess or an opening (in the present embodiment, a recess) is provided in the sealing resin layer. The recess includes the inductor thereinside when seen in a plan view.

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