Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1997-09-08
1999-11-02
Thompson, Gregory
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
176250, 176252, 257707, 257713, 361715, 361717, H05T 720
Patent
active
059782226
ABSTRACT:
A semiconductor device includes a board base having through-holes filled with a filling core, an additive layer provided on an upper surface of the board base as well as an upper surface of the filling core wherein the additive layer includes a wiring pattern having one or more paths, a semiconductor chip fixed on an upper surface of the additive layer, and nodes provided on a lower surface of the board base, wherein the one or more paths are laid out without a restriction posed by the through-holes, and are used for electrically connecting the semiconductor chip and the nodes.
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Hamano Toshio
Iijima Makoto
Minamizawa Masaharu
Mizukoshi Masataka
Takenaka Masashi
Fujitsu Limited
Thompson Gregory
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