Semiconductor device and an electronic device with the semicondu

Details Semiconductor device and an electronic device with the semicondu Semiconductor device and an electronic device with the semicondu

1992-07-21

1993-11-30

Pascal, Robert J.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Insulating material

257707, 257723, 257724, 257729, 257734, 257735, H01L 2302

Patent

active

052668347

ABSTRACT:
A package is provided for achieving higher packing density and higher circuit integration of memories, in particular, a structure is provided having a plurality of thin, surface mount packages which are stacked up. Each of the laminated packages includes a semiconductor pellet, leads fixed to the front surface of the pellet, a radiating plate fixed to the rear surface of the same, and a resin mold member. To achieve a stabilized laminated structure, the mold member is shaped into a convex form on the front side of the pellet and into a concave form on the rear side of the same, so that the concave portion of one package can engage with the convex portion of another package.

REFERENCES:
patent: 3629672 (1971-12-01), Van De Water
patent: 4012765 (1977-03-01), Lehner et al.
patent: 4398235 (1983-08-01), Lutz et al.
patent: 4939570 (1990-07-01), Bickford et al.
patent: 5068712 (1991-11-01), Murakami et al.

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