Semiconductor device and an electronic device

Details Semiconductor device and an electronic device Semiconductor device and an electronic device

2006-08-22

2006-08-22

Tran, Mai-Huong (Department: 2818)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Bump leads

C257S691000, C257S698000, C257S700000, C257S778000, C257S780000

Reexamination Certificate

active

07095117

ABSTRACT:
A semiconductor device has a reduced number of external power terminals and is scaled down while suppressing power noise, and an electronic device is efficiently equipped with a bypass condenser. A package substrate has, on its surface, a semiconductor chip having a plurality of output circuits and at least one electrode for supplying a voltage to each of the output circuits, and is provided with external terminals on its back surface and has a plurality of wiring layers.

REFERENCES:
patent: 6369443 (2002-04-01), Baba
patent: 6396136 (2002-05-01), Kalidas et al.
patent: 9-22977 (1997-01-01), None
patent: 11-34886 (1999-02-01), None

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