Semiconductor device and a process for producing a semiconductor

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357 41, 357 59, 357 64, 357 231, H01L 2702, H01L 2904, H01L 29167, H01L 2701

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049705687

ABSTRACT:
The present invention relates to semiconductor device, a e.g., a CMOS, comprising a denuded region and a bulk-defect region, as well as the process for producing, e.g., a CMOS. In a conventional CMOS, the distance (dp) between the bulk-defect region and P.sup.+ -type source of drain region--(dp)--is greater than the distance (dn) between the bulk--defect--region and the P well--(dn)--. As a result, a leakage current can be generated in the PN junction. In order to eliminate the problems caused due to dp>dn, the present invention forms in a--semiconductor-substrate a bulk-defect region having a depth which is nonuniform in accordance with the nonuniform depth of the semiconductor elements.

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"Alphas Stymie Statics"; Raymond P. Capece et al, Electronics, 3/15/79; p. 85.
IBM Journal of Research & Development, "Reduction of Leakage by Implantation Gettering in VLSI Circuits", Geipel et al., vol. 24, No. 3, May 1980, pp. 310-317.

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