Semiconductor device and a process for making same having improv

Details Semiconductor device and a process for making same having improv Semiconductor device and a process for making same having improv

1992-03-19

1994-09-06

Echols, P. W.

Metal working

Method of mechanical manufacture

Electrical device making

2642711, 26427217, H01R 4300, B29B 1300

Patent

active

053436156

ABSTRACT:
A process for producing a semiconductor device having a package with a semiconductor element molded therein, and a plurality of leads, each constituted by an inner lead located inside the package and an outer lead located outside the package, the leads being arranged in a line at a predetermined pitch, and the semiconductor element being electrically connected to the inner lead of each of the leads, wherein each side edge of each of the outer leads is flat.

REFERENCES:
patent: 5152056 (1992-10-01), Shook
Patent Abstracts of Japan, vol. 007 No. 194 (E-195) 24 Aug. 1983 & JP-A-58 095 851 (Matsushita Denshi Kogyo KK) 7 Jun. 1983 *abstract*.
Patent Abstracts of Japan, vol. 010, No. 145 (E-407) 28 May 1986 & JP-A-61 007 653 (Nippon Denki KK) 14 Jan. 1986 *abstract*.

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