Semiconductor device and a method of producing the same

Electricity: conductors and insulators – Feedthrough or bushing – Compression

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

174 52FP, 357 74, 357 81, H01L 3902

Patent

active

046912258

ABSTRACT:
A semiconductor device comprising a package base whose material is glass epoxy or the like, a plurality of leads which are formed in a manner to extend from the front surface to the rear surface of the package base, a semiconductor element which is fastened to the package base and which is electrically connected to the leads, and a resin which seals, at least, the semiconductor element and electrical connection parts between the element and the leads.

REFERENCES:
patent: 3778685 (1973-12-01), Kennedy
patent: 3916434 (1975-10-01), Garboushian
patent: 3936866 (1976-02-01), Grossman et al.
patent: 4079511 (1978-03-01), Grabbe
patent: 4190855 (1980-02-01), Inoue
patent: 4218701 (1980-08-01), Shirasaki
patent: 4246595 (1981-01-01), Noyori et al.
patent: 4280132 (1981-07-01), Hayakawa et al.
patent: 4288841 (1981-09-01), Gogal
patent: 4300153 (1981-11-01), Hayakawa et al.
patent: 4366342 (1982-12-01), Breedlove
patent: 4459607 (1984-07-01), Reid
patent: 4463217 (1984-07-01), Orcutt
patent: 4477827 (1984-10-01), Walker et al.
patent: 4495376 (1985-01-01), Hightower et al.
patent: 4496965 (1985-01-01), Orcutt et al.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Semiconductor device and a method of producing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Semiconductor device and a method of producing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and a method of producing the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1267774

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.