Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate
2005-08-02
2005-08-02
Wilson, Allan R. (Department: 2815)
Active solid-state devices (e.g., transistors, solid-state diode
Lead frame
With structure for mounting semiconductor chip to lead frame
C257S668000, C257S675000
Reexamination Certificate
active
06924549
ABSTRACT:
Means for forming a package is disclosed on which is mounted a semiconductor chip with a high-speed LSI formed thereon, using a wire bonding method. The package comprises a semiconductor chip, a die pad smaller than a main surface of the semiconductor chip, a sealing member, plural leads each comprising an outer terminal portion and an inner lead portion, and plural bonding wires for connection between bonding pads formed on the semiconductor chip and the inner lead portions of the leads, each of the inner lead portions being bent in a direction away from a mounting surface of the sealing member, thereby approximating the height of the chip-side bonding pads and that of a bonding position of the inner lead portions to each other, whereby the wire length can be made shorter and it is possible to suppress an increase in inductance of the wire portions and attain impedance matching at various portion of a high-frequency signal input/output transmission path.
REFERENCES:
patent: 5291059 (1994-03-01), Ishitsuka et al.
patent: 5428248 (1995-06-01), Cha
patent: 5436500 (1995-07-01), Park et al.
patent: 6028350 (2000-02-01), Sabyeying
patent: 6727590 (2004-04-01), Izumitani et al.
patent: 07-147352 (1995-06-01), None
Kikuchi Hiroshi
Nakazato Norio
Nose Fujiaki
Ueno Satoshi
Hitachi , Ltd.
Miles & Stockbridge P.C.
Wilson Allan R.
LandOfFree
Semiconductor device and a method of manufacturing the same does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Semiconductor device and a method of manufacturing the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Semiconductor device and a method of manufacturing the same will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3514540