Semiconductor device and a method of manufacturing the same

Fishing – trapping – and vermin destroying

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437 32, 437 33, 437150, 437162, 148DIG10, 148DIG11, 148DIG123, 148DIG124, 357 34, 357 35, 357 59, 156628, H01L 21265

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048792527

ABSTRACT:
The method of manufacturing a semiconductor device according to the present invention comprises the step of forming an opening in use for forming an emitter region. This step uses the independent etching characteristics of N and P type polysilicons to simplify the opening forming process, which is very complicated in the conventional method. To be more specific, the impurity doped in the first polysilicon layer at a high concentration is diffused into the second polysilicon layer adjacent to the first polysilicon layer. When the impurity doped in the first polysilicon layer is diffused into the second polysilicon layer, the diffused impurity dominantly determines the conductivity type of that portion of the second polysilicon layer, into which the impurity is diffused. Therefore, one of the first polysilicon layer and the second polysilicon layer portion is etched by a solution, independently of the other. Since they are etched independently, a desired gap can be formed between the end portion of the first plysilicon layer and the emitter electrode.

REFERENCES:
patent: 3980507 (1976-09-01), Carley
patent: 4026733 (1977-05-01), Owen, III et al.
patent: 4057895 (1977-11-01), Ghezzo
patent: 4090915 (1978-05-01), Keller
patent: 4092209 (1978-05-01), Ipri
patent: 4157269 (1979-06-01), Ning et al.
patent: 4201603 (1980-05-01), Scott, Jr. et al.
patent: 4239559 (1980-12-01), Ito
patent: 4431460 (1984-02-01), Barson et al.
patent: 4495010 (1985-01-01), Kranzer
patent: 4735912 (1988-04-01), Kawakatsu
patent: 4735916 (1988-04-01), Homma et al.
High-Speed Self-Aligned Polysilicon Emitter/Base Bipolar Devices Using Boron and Arsenic Diffusion through Polysilicon, H. Park, T. Yamaguchi, K. Boyer, G. Eiden, C. Clawson, S. Yu, and J. Sachitano, "Extended Abstracts of the 18th (1986 International) Conference on Solid State Devices and Materials", Tokyo, 1966, pp. 729-731.

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