Semiconductor device and a method of increasing a resistance...

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics

Reexamination Certificate

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C257S209000, C257SE29141, C257SE29325

Reexamination Certificate

active

07745905

ABSTRACT:
Provided is a semiconductor device having an electric fuse structure which receives the supply of an electric current to be permitted to be cut without damaging portions around the fuse. An electric fuse is electrically connected between an electronic circuit and a redundant circuit as a spare of the electronic circuit. After these circuits are sealed with a resin, the fuse can be cut by receiving the supply of an electric current from the outside. The electric fuse is formed in a fine layer, and is made of a main wiring and a barrier film. The linear expansion coefficient of each of the main wiring and the barrier film is larger than that of each of the insulator layers. The melting point of each of the main wiring and the barrier film is lower than that of each of the insulator layers.

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V. Klee et al., “A 0.13 n m logic based embedded DRAM technology with electrical fuses, Cu interconnect in SiLk™, sub-7ns random access time and its extension to the 0.10 μm generation”, IEDM Conference (2001).

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